Active microlens alignment

customized automatic machine

  • processing from wafer to wafer
  • individual lens soldering on optical prism
  • gold-tin soldering activated by laser beam
  • placement accuracy ±1µm (high precision)
  • active alignment with setup of focus and tilt angle
  • focus range 1-8mm, tilt angle up to ±6°
  • target area for up to 6“ wafer
  • source package blue tape up to 6“ wafer
  • wafer mapping functionality (traceability, parameters)
  • destructive and nondestructive shear test
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