Die bonding - soldering

Die bonding micromodules (soldering)
customized automatic machine

  • die bonding from wafer to wafer
  • individual chip soldering on flat substrat
  • gold-tin soldering activated by laser beam
  • placement accuracy ±1µm (high precision)
  • measurement of chip placement
  • target area for up to 6“ wafer
  • source package blue tape up to 6“ wafer
  • flip chip available
  • post bond inspection (PBI) with offset correction
  • wafer mapping functionality (traceability, parameters)
  • destructive and nondestructive shear test

 

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