Wafer dicing

DISCO 600 Series automatic machine

  • dicing of silicon, glass, fused silica, ceramic
  • auto-alignment, cleaning, drying functionality
  • dicing of populated and wirebonded wafers
  • single spindle machine for up to 8“ wafers
  • double spindle machine for up to 6“ wafers
  • repeating accuracy ±1,5µm
  • step cuts, bevel cuts and dual cutting
  • high speed process
  • semiautomatic visual inspection
  • wafer mapping functionality (traceability, status)
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