Ball bonding

automatic ball bonder - DELVOTEC
automatic ball bonder, ball (stud) bumper - Palomar

  • ball/stitch application, full BSOB applications
  • chain bonds, security bonds, ball bumps, tailless bumps
  • full Range of custom bump shapes
  • fine pith capability
  • gold wire diameter from 17µm up to 75µm
  • customized loop shapes and wire lengths
  • wire deformation control capability
  • placement accuracy ± 3µm
  • wirebonding and transportation in customized carriers
  • deep access capability
  • high speed process
  • wafer mapping functionality (traceability, parameters)
  • proces stabilization (SPC, failure statistics, proces analysis, etc.)
  • destructive and nondestructive pull test according MIL-STD or other norms
  • ball shear test according MIL-STD
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