Ball bonding

automatic ball bonder - DELVOTEC
automatic ball bonder, ball (stud) bumper - Palomar

• ball/stitch application, full BSOB applications
• chain bonds, security bonds, ball bumps, tailless bumps
• full Range of custom bump shapes
• fine pith capability
• gold wire diameter from 17µm up to 75µm
• customized loop shapes and wire lengths
• wire deformation control capability
• placement accuracy ± 3µm
• wirebonding and transportation in customized carriers
• deep access capability
• high speed process
• wafer mapping functionality (traceability, parameters)
• proces stabilization (SPC, failure statistics, proces analysis, etc.)
• destructive and nondestructive pull test according MIL-STD or other norms
• ball shear test according MIL-STD