Burn-in micromodules/TO

customized automatic towers

  • wafer and TO level process
  • parameters up to 750mA/200V
  • temperature range from +25°C to +130°C
  • customized programs
  • customized chucks
  • variable setting for each line of wafer
  • high volume process with minimum handling
  • wafer mapping functionality (traceability, parameters)
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