Die bonding - gluing
automatic machine DATACON
- chip on TO header or customized package (chip on chip,
chip on board, chip on wafer) - placement on conductive/nonconductive glue or solder paste
- handling in customized carriers
- placement accuracy ±10µm
- source package: blue tape wafer, gel pack, waffle pack
- post bond inspection (PBI) with offset correction
- high speed process
- wafer mapping functionality (traceability, parameters)
- destructive and nondestructive shear test