Die bonding - gluing

automatic machine DATACON

  • chip on TO header or customized package (chip on chip,
    chip on board, chip on wafer)
  • placement on conductive/nonconductive glue or solder paste
  • handling in customized carriers
  • placement accuracy ±10µm
  • source package: blue tape wafer, gel pack, waffle pack
  • post bond inspection (PBI) with offset correction
  • high speed process
  • wafer mapping functionality (traceability, parameters)
  • destructive and nondestructive shear test


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