Die bonding - gluing

automatic machine DATACON

• chip on TO header or customized package (chip on chip,
  chip on board, chip on wafer)
• placement on conductive/nonconductive glue or solder paste
• handling in customized carriers
• placement accuracy ±10µm
• source package: blue tape wafer, gel pack, waffle pack
• post bond inspection (PBI) with offset correction
• high speed process
• wafer mapping functionality (traceability, parameters)
• destructive and nondestructive shear test