Wafer dicing
DISCO 600 Series automatic machine
- dicing of silicon, glass, fused silica, ceramic
- auto-alignment, cleaning, drying functionality
- dicing of populated and wirebonded wafers
- single and double spindle machine for up to 8“ wafers
- repeating accuracy ±1,5µm
- step cuts and dual cutting
- high speed process
- semiautomatic visual inspection
- wafer mapping functionality (traceability, status)