Wafer dicing

DISCO 600 Series automatic machine

• dicing of silicon, glass, fused silica, ceramic
• auto-alignment, cleaning, drying functionality
• dicing of populated and wirebonded wafers
• single and double spindle machine for up to 8“ wafers
• repeating accuracy ±1,5µm
• step cuts and dual cutting
• high speed process
• semiautomatic visual inspection
• wafer mapping functionality (traceability, status)