Wedge bonding
automatic wedge bonder - DELVOTEC
- Wedge/wedge application
- gold and aluminium wire bonding
- wire diameter from 17µm up to 75µm
- ribbon bonding for high frequency applications
- room temperature wire bonding capability
- customized loop shapes and wire lengths
- wire deformation control capability
- placement accuracy ± 3µm
- wire bonding and transportation in customized carriers
- deep access capability
- high speed process
- wafer mapping functionality (traceability, parameters)
- destructive and nondestructive pull test according MIL-STD or other norms
