Wedge bonding

automatic wedge bonder - DELVOTEC

  • Wedge/wedge application
  • gold and aluminium wire bonding
  • wire diameter from 17µm up to 75µm
  • ribbon bonding for high frequency applications
  • room temperature wire bonding capability
  • customized loop shapes and wire lengths
  • wire deformation control capability
  • placement accuracy ± 3µm
  • wire bonding and transportation in customized carriers
  • deep access capability
  • high speed process
  • wafer mapping functionality (traceability, parameters)
  • destructive and nondestructive pull test according MIL-STD or other norms
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