Service provider in photonics since 2006

Like Jason and the Argonauts ventured into unexplored realms, the Argotech team is heading for new frontiers in semiconductor photonics and microelectronics.

About us
About us

About ARGOTECH

  • Independent private company founded in 2006.
  • Assembly and R&D services provider in optics, electronics and mechanics.
  • Our capabilities are based on knowledge and skills from the time Siemens and Infineon set up their production in our region in the 1990s.
  • Over 1000 square meters of ISO 7 and 8 class cleanroom premises.

Argotech a.s. is an independent private company located in the Czech Republic in Central Europe. We focus on providing assembly, development and engineering services in the fields of fiberoptics, semiconductor photonics, microelectronics and micromechanics.

At our facility, we offer the entire back-end assembly process chain, from wafer level to full optical assembly of customised semiconductor packaging solutions. This enables prototyping and pilot production with the potential to rapidly scale up to volume production. Our R&D teams can assist with feasibility studies, product design, prototyping, product qualification and process modifications.

OUR MISSION:

To provide continuous support for customers worldwide including manufacturing, development and engineering services focused on design, process development as well as expertise in optics, electronics and mechanics.

About us
The benefits

The Benefits Of Argotech

  • European business approach focusing on quality and long term partnership.
  • Czech smart solutions based on many years of regional experience in electronics.
  • We honour agreements with our customers to remain a reliable partner in a demanding industry.
  • Long-term collaborations with international scientific institutions, universities and world leaders in the business. It enables us to keep up to date with the latest developments.
  • Argotech is certified by ISO9001 since 2/2011.

Argotech is exclusively a service provider offering various semiconductor packaging platforms but does not market its own products.

The SERVICES we offer can be divided into three main groups:

  • Manufacturing services
  • R&D services
  • Testing services

We prefer all the projects and contracts to be secured by a non-disclosure agreement.
For this reason, our references are practically limited to projects that we are allowed to publish. Please visit our REFERENCES for more information.

2022

New website design implemented.

2021

Started to implement digitalization elements into production processes.

2020

Most succesful year in our history in terms of overal turnover. Set up plan for investments in production and laboratory equipment.

2019

We are expanding the numbers of our colleagues.

2020

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2017

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2015

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2011

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History

Our history

The company was founded in 2006 based on existing tradition of microelectronics available in the region after the restructuralization of Siemens and Infineon afterwards.

INDUSTRY

High-tech sensors
Durable data transfer

AUTOMOTIVE

LIDARs
Lighting

AEROSPACE

High speed data
Compact & Hermetic

HEALTHCARE

Non-invasive diagnostics
Life quality improvement

DEFENCE SECURITY

Detection
Durability

DATA TELECOM

Customized transceivers
Big data

Argotech

History

2023

NEW TECHNOLOGY

Expanding the technology for precise hermetic assemblies in a protective atmosphere.

NEW TECHNOLOGY for R&D

Framework agreement signed to use equipment including PacTech Solder ball jetting, Zygo 3D profiler, Amtek Precise dispensing, Weiss Shock testing chamber.

2022

2021

NEW TECHNOLOGY

Complete technology upgrade for automatic Die-Attach process.

Advanced Sensing market

R&D and assembly support for LIDAR applications based on SiPh PIC chips.

2020

2019

TEAM EXPANSION

Recruiting new members to production, R&D and other supporting teams.

Silicon Photonics project

Silicon Photonics assembly and packaging technology improved and utilized in project PIXAPP within EU programme Horizon 2020, (see REFERENCES).

2017

2016

ENTERING the CERN project

NEW TECHNOLOGY

Flip-chip system upgrade enabling submicron placement accuracy for packaging of the newest chips.

2015

2014

First EU funded R&D project

With project ADDAPT we entered the European Union programme FP7-ICT,
(see REFERENCES).

QUALITY MANAGEMENT

Company ISO9001 certificated
by Bureau Veritas.

2011

2010

NEW PRODUCTION PREMISES

Construction of new production cleanroom premises and relocation.

NEW TECHNOLOGY

Massive production technology
and equipment procured.

2008

2007

TEAM EXPANSION

Significant company development
and recruitment.

COMPANY ESTABLISHMENT

incorporation of joint-stock company
on 23rd May 2006

2006

Job offer
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Přidejte se do našeho týmu a získejte nové zkušenosti a znalosti v oblasti mikroelektroniky, přesné mechaniky a fotoniky.

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