Specialists in semiconductor assemblies and packaging

We keep supporting our partners in pushing the boundaries of the latest technologies in optics, microelectronics and mechanics.

References

Our Customers

We are a partner to a wide range of commercial customers in variety of sectors and industries. In addition to the frequent applications in industrial sensors and transceivers for data & telecom, we register increasing demand from defence & security and healthcare markets.

We always respect the mutual non-disclosure agreement and do not intend to show off our partners’ projects. We are happy to contribute to their success. 

We have been supporting international universities and research institutions in public funded projects. The non-confidential parts of these projects are the only references we can share.

References

EU projects

We always respect the mutual non-disclosure agreement and do not intend to show off our partners’ projects. All we need is that they like to come back to us and sometimes recommend us to their partners. We do not shy away from one-off tasks, joint projects involving universities and European institutions. We always welcome a longer-term project at the international level within the latest technologies and trends. We are involved mainly in Research and Innovation programmes under funding framework programme currently called Horizon Europe (with previous name Horizon 2020). Together with other private companies, universities, consortia we participate in following goals of EU:
  • Tackles climate change
  • Boosts the EU’s competitiveness and growth
  • Facilitates collaboration and strengthens the impact of research and innovation in developing, supporting and implementing EU policies while tackling global challenges
  • Supports the creation and better diffusion of excellent knowledge and technologies
  • Creates jobs, fully engages the EU’s talent pool, boosts economic growth, promotes industrial competitiveness and optimises investment impact within a strengthened European Research Area.

2019 - 2021

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2009 - 2014

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EU projects

ID projektu:101093166
  • Biosensing
  • Photonics packaging
2023 – 2026
ID projektu:101093012
  • Lidar & Radar
  • Chip to chip coupling
2023 – 2026
ID projektu:101093008
  • Mid & Near IR sensing
  • QCL hybrid integration
  • PIC hybrid integration
2023 – 2026
ID projektu:101092723
  • Multispectral sensing
2022 – 2026
ID projektu:101070342
  • III-V hybrid integration
  • Chip to chip coupling
2022 – 2026
ID projektu:101070238
  • RF design
  • Chip to chip coupling
2023 – 2026
ID projektu:101070178
  • RF design
  • Photonics integration
2023 – 2025
ID projektu:101016956
  • Mid IR sensing
  • Beam collimation
  • Routing back to chip
2021 – 2024
ID projektu:101004253
  • RF design
  • Photonics integration
  • Space application
2020 – 2023
ID projektu:871875
  • Sensor for carbon fibre processing
  • Specific photonics integration
2020 – 2023
ID projektu:871741
  • RF design
  • Photonics integration
  • Optical switch
2019 – 2023
ID projektu:871547
  • Healthcare diagnostics
  • Hybrid integration
2020 – 2024
ID projektu:857775
  • High efficiency solar panel technology
2019 – 2023
ID projektu:780930
  • RF design
  • Monolithic photonics integration
2018 – 2021
ID projektu:780240
  • MID IR sensing
  • Photonics hybrid integration
  • QCL hybrid integration
2017 – 2021
ID projektu:731954
  • SiPh integration
  • RF design
  • Micro fluidics
2017 – 2021
ID projektu:619197
  • RF design
  • MM photonics chips integration
2013 – 2017
AMBROSIA
AMBROSIA Advancing diagnosis...
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PARALIA
PARALIA Radar and lidar...
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M3NIR
M3NIR Excellent accuracy...
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IBAIA
IBAIA A new multisensing...
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DYNAMOS
DYNAMOS Dynamic and reconfigurable...
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NEUROPULS
NEUROPULS Neuromorphic...
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ADOPTION
ADOPTION Advanced co-packaged...
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PASSEPARTOUT
PASSEPARTOUT Excellent...
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PhLEXSAT
PhLEXSAT Novel photonics...
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SEER
SEER Silicon photonic...
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TWILIGHT
TWILIGHT Meeting tomorrow's...
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InSiDe
InSiDeIntegrated Silicon...
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HIPERION
HIPERION A boost for...
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PICTURE
PICTURE Advanced material...
Read More
REDFINCH
REDFINCH Fully Integrated...
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PIXAPP
PIXAPP Photonic Integrated...
Read More
ADDAPT
ADDAPT Adaptive Data...
Read More

EU Projects

We are mainly involved in Research and Innovation programmes under the funding framework programme currently called Horizon Europe.

The most common role of ARGOTECH is:

  • advanced packaging solutions for semiconductor and photonics
  • technology development 
  • process validation 
  • prototyping and demonstration

Together with other private companies, universities and consortia we participate in the following EU strategy.

Research and innovation strategy 2020-2024

Who we work with?

Healthcare

Healthcare

Automotive

Automotive

Healthcare

Healthcare

Automotive

Our Services
and Technologies

  • Our technology can be used partially or as a complete assembly process.
  • If you need to bring your idea to life, take a look at our R&D capabilities.
  • We can provide Proof of Concept data on your prototype
    if it is worth improving or not.
  • Do you lack the characterisation and test devices in your production or R&D?

Manufacturing

  • Flexible volumes
  • CM/OEM/ODM
  • UV to MIR applications
  • SiPh into TO package
  • Complex packaging solution
  • WLA and Component level Assembly
  • PFMEA/Traceability/SPC
  • Production data management

R&D services

  • Simulations 
  • Feasibility study
  • Packaging design
  • Prototype builds
  • Assembly process development
  • Sample batch evaluation
  • Private commercial projects
  • Public funded projects

Testing services

  • Characterization
  • Qualification
  • Burn-In
  • Enviromental tests
  • Shock temperature tests
  • Accelerated ageing
  • Selected standards compliance test
  • Long term endurance tests