Wire bonding
Wire bonding has been the most commonly used method for component interconnection with substrate, PCB or package module. The most standard is the Ball bonding with ball/stitch method. We can process also full BSOB or wedge/wedge method.
How it works?
Every year the components get a bit smaller, so using the 17um gold wire we can hit the bond pad pitch (BPP) even under 50um. It means that together with placement accuracy +/-3um we are able to provide wire bonding services of the newest components including ball shear test according to MIL standards. Nemo enim ipsam voluptatem quia voluptas sit aspernatur aut odit aut fugit, sed quia consequuntur magni dolores eos qui ratione voluptatem sequi nesciunt. Nemo enim ipsam voluptatem quia voluptas sit aspernatur aut odit aut fugit, sed quia. Nemo enim ipsam voluptatem quia voluptas sit aspernatur aut odit aut fugit, sed quia consequuntur magni dolores eos qui ratione voluptatem sequi nesciunt. Nemo enim ipsam voluptatem quia voluptas sit aspernatur aut odit aut fugit, sed quia
Parameters
Wire material: gold or aluminium
High speed or low volume batch
Method: Ball/Stich, BSOB, wedge/wedge, ribbon wire
Bond pad pitch: from 50um
Placement accuracy: ±3µm
Typical service model
Typical service model
Delvotec
Palomar
Are you interested in our services?
Be sure to contact us
Related services
Nemo enim ipsam voluptatem quia voluptas sit aspernatur aut aut fugit, sed quia consequuntur magni dolores eos qui ratione voluptatem sequi nesciunt. Nemo enim ipsam voluptatem quia voluptas sit aspernatur aut odit aut fugit, sed quia
Hybrid intergration
Nemo enim ipsam voluptatem quia voluptas sit aut odit aut fugit, sed quia magni dolores eos qui. Nemo enim ipsam voluptatem quia voluptas….
3D structures
Nemo enim ipsam voluptatem quia voluptas sit aut odit aut fugit, sed quia magni dolores eos qui. Nemo enim ipsam voluptatem quia voluptas….
Silicon photonics
Nemo enim ipsam voluptatem quia voluptas sit aut odit aut fugit, sed quia magni dolores eos qui. Nemo enim ipsam voluptatem quia voluptas….